发明名称 |
Method of making a circuitized substrate assembly with carrier having substrates therein |
摘要 |
A method of making an assembly comprised of several circuitized substrates, e.g., printed circuit boards, frictionally retained within a common carrier through the use of appropriate, paired locking means. The method is adapted for subsequent processing (e.g., electronic component attach) of the substrates while assuring substrate retention. Subsequently, the substrates can be readily separated (removed) from the carrier.
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申请公布号 |
US6338194(B1) |
申请公布日期 |
2002.01.15 |
申请号 |
US20000477003 |
申请日期 |
2000.01.03 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BENZ GERHARD;FINZE J&TOPL,RGEN;WALKER MANFRED |
分类号 |
H05K3/00;H05K13/00;(IPC1-7):H05K3/36 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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