| 摘要 |
Structures and methods are disclosed in conjunction with the fabrication of electrical lead transfer feedthroughs with respect to a sealed cavity. In some applications such as capacitive pressure sensing, the cavity may include an outer wall, in which case the electrically insulating barrier is preferably U-shaped, with the ends of the U terminating at the outer wall. The feedthrough section may alternatively take the form of an island of conductive material surrounded by the electrically insulating barrier, thus assuming an O-shape. The cavity may be evacuated or filled with specific gases at specific pressures. As such, the invention finds application in the packaging (vacuum or controlled environment) and production of a variety of transducers including but not limited to pressure sensors, flow sensors, optical devices (e.g., infrared detectors, ccd camera, and flat-panel displays) and resonating devices, such as gyroscopes, accelerometers, yaw sensors, telecommunication devices, etc. Multiple lead transfer feedthroughs may also be produced using this invention.
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