| 发明名称 |
EPOXY RESIN COMPOSITION AND RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE |
| 摘要 |
<p>An epoxy resin composition comprising (A) a bifunctional crystalline epoxy compound, (B) an amorphous trisphenolmethane type epoxy compound having three or more of epoxy groups in a molecule, and (C) an epoxy curing agent having phenolic hydroxyl groups. The resin composition has an excellent moldability (low viscosity and can be filled with filler with high density) and high softening point, and is used preferably as an encapsulating material for electronic device.</p> |
| 申请公布号 |
SG85624(A1) |
申请公布日期 |
2002.01.15 |
| 申请号 |
SG19990001099 |
申请日期 |
1999.03.11 |
| 申请人 |
SUMITOMO CHEMICAL COMPANY, LIMITED |
发明人 |
YOSHIKI MATSUOKA;YASUHIRO HIRANO;NOBUYUKI NAKAJIMA |
| 分类号 |
C08G59/32;C08G59/38;C08G59/62;C08L63/00;H01L23/29;(IPC1-7):C08L63/00;H01B3/40;H01L23/28 |
主分类号 |
C08G59/32 |
| 代理机构 |
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