| 摘要 |
PROBLEM TO BE SOLVED: To obtain both a heat-sensitive adhesive and a heat-sensitive adhesive sheet containing a compound which is nonadhesive at a normal temperature but can develop adhesive property by heating as a solid plasticizer similarly to a phthalic acid-based compound by finding the compound. SOLUTION: This heat-sensitive adhesive is characterized by comprising diethyl [[3,5-bis(1,1)-dimethylethyl)-4-hydroxyphenyl]methyl] phosphonate of general formula (1) and a thermoplastic resin.
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