| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a polyimidesilicone resin which can form coating films at relative low temperature, has excellent adhesivity to substrates and excellent durability under highly humid conditions, and has a low stress and a high elongation, to provide a polyimidesilicone resin solution composition for forming the coating films, and to provide a polyimidesilicone resin coating film which does not cause a warped film, the corrosion of a copper plate and so on, when applied to a glass plate or the copper plate. SOLUTION: This polyimidesilicone resin coating film characterized by being obtained from an acid dianhydride and diamines containing a diaminopolysiloxane, containing siloxane residues in an amount of >=50 wt.%, and having a tensile elongation of >=400% and an elastic modulus of <=500 N/mm2. The polyimidesilicone resin solution composition characterized by comprising the polyimidesilicone resin and a ketone solvent having a boiling point of <=130 deg.C. The polyimidesilicone resin coating film characterized by comprising the polyimidesilicone resin and being formed on a substrate.</p> |
