| 摘要 |
PROBLEM TO BE SOLVED: To provide a flame-retardant epoxy resin composition which is suitable for a copper-clad laminate to use in an electronic circuit substrate and for a sealing material, a molding material, a casting material, an adhesive material or an electric insulating coating material to use in an electronic parts, and can provide a laminate which is excellent in heat resistance, flame-retardancy, flexibility and an adhesive property. SOLUTION: The flame-retardant epoxy resin composition comprises a phosphorus containing epoxy resin (A), a curing agent (B), and a block copolymer (C), wherein the phosphorus containing epoxy resin is prepared by reacting a setting epoxy resin with a phosphorus compound represented by formula (1) (wherein R is hydrogen, an aliphatic group or an aromatic group, and may be same or different) so that the phosphorus containing epoxy resin may have a phosphorus content of 0.8-8% by weight; and the block copolymer (C) is formed from a phenolic hydroxyl group containing aromatic polyamide oligomer having aminoaryl groups as the both terminals and a poly(butadiene-acrylonitrile) copolymer having carboxyl groups at the both terminals.
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