| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition capable of providing a resin cured product excellent in heat and weather resistances, electrical characteristics, etc., with slight discoloring during the curing and having quick curability at low temperatures. SOLUTION: This thermosetting resin composition is obtained by compounding a mixture (pentaerythritol tetraacrylate, etc.), comprising a polyvalent epoxy compound (a bisphenol A diglycidyl ether type epoxy resin, etc.), and a polyvalent acryloyl compound without containing an active hydrogen-containing compound, etc., as a curing agent with a catalytic amount of a compound (N,N- dimethylethylenediamine, etc.), represented by formula (I) (CH3(CH3)NCH2)n-R (I) (R is an organic group) or a compound (2,4,6-trisdimethylaminomethylphenol, etc.), represented by formula (II) (CH3(CH3)NCH2)n-R'-(X)m (II) [R' is an (n+m)- valent residue; and X is a functional group (hydroxyl group, etc.), reactive with the acryloyl group, etc.].
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