| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-free solder alloy in which no Pb is contained, the dispersion of Cu in a printed circuit board as a work to be joined into solder alloy is suppressed by the bonding of Cu with Ni as an element, that means, the Cu-erosion phenomenon is sufficiently prevented, fine cracks in a soldered part are prevented, and the mechanical strength of the soldered part is high. SOLUTION: This lead-free solder alloy has the composition consisting of, by weight, 3.5-6.0% Ag, 0.001-1.0% Ni, and the balance Sn.
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