| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin paste composition which has a low electrical resistivity, a high thermal conductivity, and an excellent adhesive property, and a semiconductor device easily produced using the composition. SOLUTION: The resin paste composition comprises (A) an acrylic acid ester compound or a methacrylic acid ester compound, (B) an acrylonitrile-butadiene copolymer, (C) an epoxydated polybutadiene, (D) a radical polymerization initiator, (E) an epoxy resin having no vinyl polymerizable unsaturated double bond, (F) an epoxy resin curing agent and (G) a metal filler. A semiconductor system is prepared by adhering semiconductor devices on a substrate material with the resin paste composition.
|
