发明名称 |
Method for forming optoelectronic microelectronic fabrication with attenuated bond pad corrosion |
摘要 |
Within a method for fabricating an microelectronic fabrication there is first provided a substrate employed within an optoelectronic microelectronic fabrication, where the substrate comprises an optoelectronic microelectronic device which is in electrical communication with a bond pad formed over the substrate. There is then processed, when fabricating the substrate to form the optoelectronic microelectronic fabrication, the substrate in the absence of optoelectronically transducable radiation, in order to attenuate corrosion of the bond pad. The method is particularly useful for forming a color filter sensor image array optoelectronic microelectronic fabrication comprising multiple photoresist based patterned colored filter layers.
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申请公布号 |
US6338976(B1) |
申请公布日期 |
2002.01.15 |
申请号 |
US20000489462 |
申请日期 |
2000.01.21 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HUANG CHIEH-CHUAN;CHU CHENG-YU;HSU SHUN-LIANG |
分类号 |
H01L23/485;H01L27/146;(IPC1-7):H01L21/00;H01L21/44;C11D9/04 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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