| 摘要 |
In an interface section, a transfer device is disposed to face a second cooling processing unit group in a processing station, and a thermal processing unit group in which thermal processing units are multi-tiered is disposed on one side and a peripheral aligner, a buffer cassette, and a wafer holding section which are vertically tiered from the top in order are disposed on the other side so that the transfer device is put between them. A secondary transfer body is disposed between the wafer holding section and an aligner, and a wafer is carried into/out of an in-stage and an out-stage in the aligner by means of this secondary transfer body. Thus, a period of time until the wafer W which has undergone exposure undergoes heat processing can be precisely managed, thereby enabling the formation of uniform line width.
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