Molding resin composition and method of molding

摘要

The present invention provides a resin composition suitable for molding a microscopic structure that has small cure shrinkage, good mold transfer properties and excellent properties for post-processing such as polishing processing and laser processing. Such a resin is a thermosetting resin composition comprising 95 to 35 wt% of a thermosetting resin and 5 to 65 wt% of organic filler having a particle size of 10 mu m or less. From such a resin, an ink ejecting apparatus having a microscopic structure, for example, a nozzle of a diameter of 30 mu m, is integrally molded.