METHOD FOR CLEANING WAFER

摘要

PURPOSE: A method for cleaning a wafer is provided to reduce a defect of a surface of a wafer by changing a film characteristic of the wafer to hydrophile property. CONSTITUTION: An upper face of a wafer(10) is rinsed by supplying DI water through a spray. The wafer(10) is fixed to a roller. A surface of the wafer(10) is processed by rotating a brush fixed to a support shaft and using NH4OH solution of 20 percent. An HF solution is supplied on the surface of the wafer(10). The surface of the wafer(10) is processed by using the brush. The surface of the wafer(10) is changed to hydrophile property by using the NH4OH solution in a liquid curtain. The wafer(10) is fixed to a finger support portion(40). The surface of the wafer(10) is changed to hydrophile property by supplying the NH4OH solution to the upper face of the wafer(10) through a supply nozzle(45).