| 摘要 |
PROBLEM TO BE SOLVED: To improve quality by determining the quality in a card base sheet state that a plurality of inlets are aligned and arranged in a card manufacturing intermediate process including a connection defect between an IC chip and an antenna, the mixing of a defective IC chip, and a defect of an antenna sec tion such as severance of wire even when the makers and types of the IC chips mounted for manufacturing a card differ. SOLUTION: This inspecting device is provided with an inspection measuring means measuring the scattering parameters in noncontact for individual inlets and an inspection determining processing means making measurement via the measuring means to determine whether the inlets are normal or defective on the card base sheet on which a plurality of noncontact IC card inlets each integrated with an IC chip and an antenna are aligned and arranged. |
