METHOD AND DEVICE FOR SOLDERING

摘要

PROBLEM TO BE SOLVED: To solve the problem that many solder balls are formed and soldered strength decreases to cause soldering quality to decrease as water in VOC-free flux vaporizes in soldering and then the amount of water in the atmosphere in a chamber increases as to a soldering method for soldering a printed wiring board as a soldered work in the atmosphere in a low-oxygen-density chamber by using the VOC-free flux. SOLUTION: Soldering can be carried out without lowering the soldering quality by controlling the amount of moisture in the atmosphere in the chamber 4 wherein the soldering is carried out by moisture controllers 30 and 31 to values within a specific range.