| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a wiring board which has very small electrodes and can have solder bumps formed securely even the aspect ratio of openings of a solder resist layer where the electrodes are exposed is high. SOLUTION: The manufacturing method for the wiring board includes a stage where solder paste 6 is printed on a group of electrodes 1 formed in the openings of the solder resist layer 2 on the wiring board 100, a 1st heat melting stage where a solder group (solder bump 7 and solder 8) is formed by heating and melting the printed solder paste 6, a press stage where the solder group (specially solder 8) is pressed from above, and a 2nd heat melting stage where a group of solder bumps 10 is formed by heating and melting the solder group (solder bump 7 and solder 8) again. |
