| 摘要 |
PROBLEM TO BE SOLVED: To provide a pattern recognition method capable of accurately detecting the orientation of a lead frame(LF) during a wire bonding process and accurately detecting the orientation of a symmetrical die (semiconductor chip) and provide a clamp therefor. SOLUTION: The pattern recognition method includes the orientation detection step of LF for judging whether LF is stably fixed on the gate 16 of LF through the observation hole 41 of the clamp and a support bar 5 of LF positioned on the outer peripheral edge of the clamp in an accurate direction and at an accurate position before LF is clamped on a heat block, an LF index step for rejudging whether LF is stably fixed on the gate of LF and the support bar of LF after LF is clamped, a VLL step for newly reading and storing each lead position of LF by a camera, and the orientation detection step of the die for judging whether the die is mounted by the specific pattern 32 of the corner of the die 30 in the accurate direction. |
