| 发明名称 |
HIGH-DENSITY COLUMN GRID ARRAY CONNECTION AND ITS MANUFACTURING METHOD |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a new semiconductor chip carrier connection which has a chip carrier and a 2nd level assembly formed by a surface amount technology. SOLUTION: The surface mount technology for a ball grid array(BGA), a column grid array(CGA), etc., is adopted and basically includes a non-solder metal connection such as a copper connection. This invention is concerned with a column grid array structure and its process. |
| 申请公布号 |
JP2002009433(A) |
申请公布日期 |
2002.01.11 |
| 申请号 |
JP20010130649 |
申请日期 |
2001.04.27 |
| 申请人 |
INTERNATL BUSINESS MACH CORP <IBM> |
发明人 |
INTERRANTE MARIO J;BRENDA PETERSON;SDIPTA K RAY;WILLIAM E SABURINSKI;AMITT K SHAAKUHERU |
| 分类号 |
B23K35/26;C22C9/02;C22C9/05;C22C13/00;C22C13/02;H01L23/12;H01L23/488;H01L23/498;H05K3/34;H05K3/40 |
主分类号 |
B23K35/26 |
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