| 摘要 |
PROBLEM TO BE SOLVED: To prevent a substrate with a slit from being covered with solder creeping up through the slit when an electronic component mounted on the substrate is jet soldered. SOLUTION: The slit 2 of the substrate 1 is masked with a masking material 6 so as to prevent jetted solder from overflowing to the top surface 1a of the substrate from the slit 2 when the electronic component 5 fitted to the substrate 1 having the slit 1 is soldered with a jet soldering device 3.
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