发明名称 PLASMA PROCESSOR AND PLASMA PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To uniform the peak-to-peak of a high frequency voltage in an electrode face which is the cause of the improvement of the uniformity of a plasma processing, in a plasma processor where a planar electrode in which an object to be processed is installed in a vacuum chamber, high frequency power is applied at the back of the electrode, plasma is generated on a side where the processed object is installed for plasma-processing. SOLUTION: A first dielectric 13 which is formed in such a way that it is sequentially thickened along a direction to an outer peripheral part from a center where high frequency power is applied is arranged in a lower electrode 5 and the impedance of the lower electrode 5 is varied in the periphery of the center and the outer peripheral part. Thus, voltage drops differ in respective parts in the lower electrode 5 and the peak-to-peak of the high frequency voltage in the lower electrode 5 is uniformed. Consequently, electric field intensity in the lower electrode 5 is uniformed, ion energy accelerated by an electric field is uniformed in the substrate face and the uniformity of the plasma processing is improved.
申请公布号 JP2002009047(A) 申请公布日期 2002.01.11
申请号 JP20000183856 申请日期 2000.06.20
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 AMANO SHIYUUSHIN;SUMITA KENJI
分类号 C23C14/34;C23C16/509;C23F4/00;H01L21/203;H01L21/302;H01L21/3065;H01L21/31;(IPC1-7):H01L21/306 主分类号 C23C14/34
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