| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device of a three-dimensional packaging module configuration high in the freedom of the kind, the combination and the wiring of IC, and excellent in easiness for assembly to the three dimensions using a flexible printed circuit board with a short delivery time, low cost and high reliability. SOLUTION: A flexible printed circuit board 11 has a second region 112 consisting of only a first region 111 containing a packaging part and a wiring part. The second region 112 is folded to the first region 111 to which electronic parts 121 and 122 have been packaged. An opening 13 contributes to a stress relaxation when bending in the direction of an arrow B. An insertion bar 15 is inserted so that the second region 112 becomes a gentle curve in the bent from in the arrow B direction of the flexible printed circuit board. The flexible printed circuit board 11 is folded, laminated and fixed with a lamination support body 14 which protects electronic parts 121 and 122. |
