| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device of a three-dimensional mounting module configuration easy for a heat radiation countermeasure in the assembly stage and a high degree of freedom in layout flexibility using a flexible printed circuit board. SOLUTION: Electronic parts 121, 122 and 123 are respectively mounted corresponding to each mounting regions 111, 112 and 113 of a flexible printed circuit board 11. In the flexible printed circuit board 11, each of the mounting regions 111 to 113 are constituted and fixed as folded in an order (f1 to f3) on a base region 110 with a spacer 13. Also, a lead portion for heat radiation 114 is provided as connecting to the mounting region 113 for ensuring the heat dissipation path of an electronics part 123. The lead portion 114 for heat radiation has a conductor pattern 115, and connected to the mounting area of a main board with such as solder. |
