POLISHING DEVICE AND POLISHING METHOD FOR III-V GROUP COMPOUND SEMICONDUCTOR CRYSTAL SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a polishing device by which a III-V group compound crystal substrate can be easily held without wax and a substrate exhibiting a high surface flatness can be obtained. SOLUTION: A device polishes the surface of a substrate (w) held by a carrier 4 by pressing it onto the surface of an abrasive cloth 3a pasted on a platen 3 mounted around a rotating driving shaft 2 from above the abrasive cloth 3a and sliding the substrate (w) and the abrasive cloth 3a. The carrier 4 is provided with a substrate mounting member which is formed by mounting an acid-resistant and flexible rubber film 5 in truncated cone form, and having a hollow in its center along the perimeter of a washer 6 in truncated cone form fixed on a mounting plate in disc form fixed on the lower end of a cylindrical head 15 mounted on a hollow shaft 13, in such a way that the washer 6 and the flexible film 5 form a hermetical space; a gas supply tube and gas depressurizing tube 8 which are provided inside the hollow shaft 13 and the connected to a gas flow path provided approximately in the center of the washer 6 from the head up to the bottom in vertical direction; and a cylindrical housing member 15a which surrounds the periphery of the substrate mounting member and has a height with which it can not reach the lower end surface of the substrate mounted on the substrate mounting member.