| 摘要 |
PROBLEM TO BE SOLVED: To obtain manufacturing equipment of a semiconductor device which is easy to maintain and control. SOLUTION: A disk-shaped hot plate 22 is covered with a cylindrical hot plate cover 23. Since sublimation substance from a wafer W, which is put on the hot plate 22 and heated, is shielded with a shielding member 26 which is interposed inside the hot plate cover 23, the sublimation substance will not be deposited inside the hot plate cover 23. Thereby, the shielding member 26 is detached and can be re-used through elimination of deposited sublimation substance by cleaning. Since the shielding member 26 can be cleaned and exchanged according to the depositing conditions of the sublimation substance, maintenance and control are facilitated. The possibility of the deposited sublimation substance falling on the wafer and generating pattern defects will not occur. |
