MULTI-LAYER PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a processing circuit with small influence from voltage variation while processing components are mounted near each other in location. SOLUTION: The multi-layer printed circuit board 270 includes a first conductive face 292 of a first shape, and a second conductive face 294 of a second shape. The first shape is almost the same as the second shape, and the first conductive face 292 is mounted adjacently to the second conductive face 294. The first conductive face 292 is arranged in parallel with the second conductive face 294 in the multi-layer printed circuit board.