| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for mounting semiconductor flip chip which can pass reliability tests by reducing stress and improving connecting strength in an bonding interface, and preventing failures in dimensional accuracy and planarity. SOLUTION: On a surface of a conductor circuit substrate 12, that is, an organic resin substrate on which a conductor circuit pattern 11 equipped with a plurality of connecting terminals 15 is formed, thermosetting resin binder is applied and a binder layer 18 is formed. Then, the semiconductor flip chip 22 with a plurality of electrode bumps 21 is mounted on the binder layer 18 with the face down. The chip is pressed and the binder layer 18 is spread by applying predetermined pressure to form an electrical conducting circuit by pressure welding the electrode bump 21 to the connecting terminal 15. After that, the required number of gradational thermosetting processes are conducted on the binder layer 18 with the semiconductor flip chip 22 being applied with pressure.</p> |
