发明名称 FLATTENING METHOD AND DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent increase in cost by reducing abrasive grains which are discarded without directly contributing to finishing. SOLUTION: The content of abrasive grains contained in a fixed abrasive board is distributed in such a way that the abrasive grains are uniformly dispersed and distributed in conventional way in a region mainly contributing to the finishing and on the other hand, the inside and outside of the fixed abrasive board which do not contribute to the finishing have the constitution containing no abrasive grain. By distributing the density of abrasive grains in this way, the efficiency of utilization of the abrasive grains is improved and the cost can be reduced.
申请公布号 JP2002009027(A) 申请公布日期 2002.01.11
申请号 JP20000194880 申请日期 2000.06.23
申请人 HITACHI LTD 发明人 KATAGIRI SOUICHI
分类号 B24D7/14;H01L21/304;(IPC1-7):H01L21/304 主分类号 B24D7/14
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