SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, CIRCUIT BOARD AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device, its manufacturing method, a circuit board and electronic equipment without bringing the end of a semiconductor chip into contact with a wiring pattern. SOLUTION: The manufacturing method of the semiconductor device wherein the semiconductor chip 40 having an electrode 42 is opposed to a face formed on the electrode 42 and mounted on a bendable board 10 forming the wiring pattern 10 includes a step for bending the board 10 so that an interval between the semiconductor chip 40 and the board 10 is wider than the center part on the end of the semiconductor chip 40.