| 摘要 |
PROBLEM TO BE SOLVED: To make a high frequency device thin. SOLUTION: This device is opened in the upwards and downwards directions and is comprised of a metallic frame 11 having a cuboid shape, a printed board which is equipped in the frame 11 and on which electronic parts are mounted, a metallic outer cover 18 which closes an aperture of the frame 11, and a metallic internal cover 22 which is inserted between the outer cover 18 and the frame 11. This device can be made thin because a project part 19 which projects toward the internal cover 22 is provided on the outer cover 18.
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