SUBSTRATE FOR SURFACE MOUNT

摘要

PROBLEM TO BE SOLVED: To eliminate recognition error in an automated component mounting machine by arranging patterns for protection which prevent solder resist from flowing into mark regions for recognition on a substrate for surface mount. SOLUTION: Conductor patterns 11 for electroplating are connected with marks 4 for recognition of the substrate 1 for surface mount. On the conductor patterns 11, the protective patterns 7 are additionally formed in the vicinities of the marks 4 against solder resist approaching the marks 4.