发明名称 DIE BONDING EQUIPMENT AND STOCKER FOR DIE BONDING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a die bonding equipment wherein the mounting of electronic components onto metal stems may be automated, and also provide a stocker for the equipment. SOLUTION: In the stocker 3, a plurality of stems 2 are arranged in a line for each carrier 70, and many of these stems 2 are aligned like a matrix in a magazine 74. Due to this structure of the magazine 74, those many aligned stems 2 can be collectively supplied into the stocker 3, making the separate management of the stems possible for each magazine 74 or for each carrier 70. Moreover, by applying such a structure that positioning recesses 88 are formed at both ends of the carrier 70 and then positioning pins 86, 87 are inserted into those positioning recesses 88, each carrier 70 can be positioned and fixed at a specified position within the stocker 3 because each carrier 70 is forcibly held by the positioning pins 86, 87 from both sides even in the case that the carriers 70 are not aligned well in the magazine 74. Such a stocker structure is helpful for automation.
申请公布号 JP2002009094(A) 申请公布日期 2002.01.11
申请号 JP20000188232 申请日期 2000.06.22
申请人 NIDEC COPAL CORP;NIDEC TOSOK CORP 发明人 KAWASHIMA YOSHIYUKI;TAJIMA MAKOTO;IZUMI MASANORI
分类号 H01L21/52;(IPC1-7):H01L21/52 主分类号 H01L21/52
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