| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic chuck that can suppress a leak of a heat transfer gas from a clearance between a wafer and a chuck and can hold a pressure of the heat transfer gas stably. SOLUTION: A pin hole 51 is shown at the right side of the chuck 9 in a figure. The pin hole 51 penetrates through the chuck 9 and a stage 7 and reaches the lower surface of the stage 7. A convex part 55 is formed so as to separate the recess 27 and the pin hole 51 at the periphery of the pin hole 51 of a suction face of the chuck 9 (top surface). The height of the convex part 55 is the same as the height of the top surface of the chuck 9 (peripheral convex part 9a or the like). When the wafer 11 is sucked and fixed on the chuck 9, the heat transfer gas applied in the clearance 27 is hard to escape into the pin hole 51.
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