| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method for an electronic component which has high connection reliability where the electronic component and a motherboard sealed by package technology without using underfill. SOLUTION: A conductor pad is coated by a precoating process 5 for a mounted component joining pad of a motherboard 1 and sufficient strength is secured between a solder ball 7 used for joining to an electronic component 8 and the conductor pad 2.
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