发明名称 THERMOELECTRIC MODULE
摘要 PROBLEM TO BE SOLVED: To provide a thermoelectric module in which heat dissipation/ absorption performance can be enhanced. SOLUTION: In the inventive thermoelectric module 1, adjacent P type thermoelectric element 2 and N type thermoelectric element 3 are connected through an electrode 4k. The electrodes 4k are arranged in lattice and bonded integrally through an insulating bonding material 46, e.g. thermoplastic polyimide resin.
申请公布号 JP2002009351(A) 申请公布日期 2002.01.11
申请号 JP20000189527 申请日期 2000.06.23
申请人 KOMATSU LTD 发明人 SHIBATA ISAO
分类号 H01L35/32;H01L35/34;(IPC1-7):H01L35/32 主分类号 H01L35/32
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