| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical axis inclination detection method and the device and a bonding method and the device with which the position of a light emitting point and the inclination of a light emitting optical axis are observed and adjusted, while holding the light emitting surface of a light emitting element at the time of mounting the light emitting element such as an LD on a semiconductor substrate. SOLUTION: The light emitting element (LD 10a) is made to emit light and the light is received at least at two parts in a Z axis direction in a light receiving part 52 through the hollow hole 28 of a mounting tool 16. A deviation amount from a reference optical axis is measured at the respective parts, and the optical axis inclination of the light from the light emitting surface of the LD 10a is calculated from the measured result.
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