| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device of three-dimensional mounting module constitution using a flexible printed circuit board which possesses structurally an excellent assembability, repair workability and a noise proof performance. SOLUTION: Mainly electronic arts 121, 122 and 123 are mounted on respective mounting regions 111, 112 and 113 of the flexible printed circuit board 11. A flexible printed circuit board 13 is constituted such that respective mounting regions 111 to 113 are to be folded and fixed in a predetermined order (f1 to f3) on a base region 110. A conductive region 116 of a specified potential, for example, the ground potential is formed at the periphery of each mounting regions 111 to 113. Each of the conductive processing spacers 13 is folded and fixed on the flexible printed circuit board, having a specified outer frames for protecting the above electronic parts 121-123 and is electrically connected to conductive areas 116.</p> |
