| 摘要 |
PROBLEM TO BE SOLVED: To prevent generation of voids in sealing resin and avoid generation of imperfect connection and deterioration of sealing strength, in a printed wiring board with a heat sink, which is used for a driver module of a plasma display panel or the like. SOLUTION: Elements 2 are bonded to the surface of a heat sink 3, and the heat sink is stuck on the back of a printed wiring board 1 by using an adhesive sheet 4. On the back of the printed wiring board 1, a ground pattern is continuously formed surrounding the elements 2. On he adhesive sheet 4, notches 41 which stretch from the vicinity of the ground pattern as far as outside end of the adhesive sheet 4 are formed. As a result, air enclosed in the periphery of the ground pattern does not enter the inside of the ground pattern when heat sink 3 is stuck on the printed wiring board 1.
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