| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable resin paste for semiconductor which contains only a small quantity of chlorine ions in a material to be cured and can be cured at a high speed by an inline curing equipment. SOLUTION: The resin paste for semiconductor consists of epoxy resin, potential curing agent, 2-allyl-4,5-diphenylimidazole, and inorganic filler. The paste contains 5 to 10 pts.wt. of the 2-allyl-4,5-diphenylimidazole with respect to 100 pts.wt. of the epixy resin.
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