| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip-like capacitor which is made to cope with a high- density mounting substrate and improved in product characteristic, so as to suppress the occurrence of short circuits. SOLUTION: This chip-like capacitor is composed of a capacitor element 2, provided with a lead-out lead 1 and an electrode substrate 7 to which the element 2 is electrically connected, and the lead 1 is electrically connected to the substrate 7 via a metallic wire material 5 and conductive adhesive layers 8. In addition, the element 2 is connected electrically to the substrate 7 through the adhesive layers 8 and the element 2, the lead 1, the material 5, and the adhesive layers 8 are coated with an encapsulating resin 9. One side of the material 5 is formed inclined toward the substrate 7.
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