| 摘要 |
PROBLEM TO BE SOLVED: To reduce dust adhered to the surface of an object to be polished, to reduce scratches while ensuring a high flattening property and further to eliminate microscopic irregularity of a semiconductor wafer itself before finishing, that is, to correct defects expressed as waviness, nanotopology or the like by a simple polishing method. SOLUTION: The polishing pad consists of an organic polymeric matrix which is formed by laminating materials in sheet form which are hydrophilic and are substantially insoluble in water. |
