ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electronic component where each bump and a metallic layer provided on a support have an identical adhesive strength to each other even when a mount face of the support such as a package and a substrate on which an element is mounted is not flat. SOLUTION: The electronic component is provided with a package 3 having a metallic layer 4 and a SAW element 7 that is mounted on this metallic layer 4 via bumps 6a, 6b. The middle part of the mount part of the SAW element 7 on the package 3 is thicker than the outer circumferential parts, the height of the bumps 6a, 6b mounted on the middle part of the SAW element 7 is lower than that of the bumps mounted on the circumferential part so as to reduce dispersion in forces exerted onto the metallic layer via the bumps 6a, 6b thereby attaining the purpose above.