ELEMENT MOUNTING BOARD AND ELEMENT MOUNTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an element mounting board and an element mounting method capable of reducing a manufacturing cost by enabling the formation of soldering bump even when the surface of electric wiring having soldering wettability is exposed and shortening a manufacturing process. SOLUTION: The element mounting board has a board 1 having silicon oxidation film 2 flipping a molten solder on a surface, the electric wiring 3 formed on the board 1, an electrode 6 covering part of the electric wiring 3 and having soldering wettability, and a soldering film 7 covering the whole of the electrode 6 and covering part of the silicon oxidation film 2 without directly coming into contact with the electric wiring 3.