| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that some prior art heat dissipation structure cannot be used when the heat dissipation structure cannot hold a hook on a heat generating body, because a heat dissipation body is fixed to the heat gener ating body by the hook mounted on a holder for the heat dissipating body. SOLUTION: The structure of the present invention has locking chip parts 4, 5 mounted on a printed board 1, and a heatsink 3 is fixed against an IC 2 by a heatsink holder 6 having spring portions 6a, 6b, and the ends are locked by the chip parts 4, 5.
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