发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board wherein chamfering amount can be effectively measured after short rings arranged in order to prevent electrostatic breakdown are eliminated by chamfering and terminal cutout defect can be easily detected. SOLUTION: On an active matrix board 2, wirings 14 for inspection which are not used in an ordinary operation are formed in parallel with gate electrode wirings 4 and source electrode wirings 5. On the wirings 14 for inspection, short rings 15 for inspection whose width is greater than that of short rings 13 for short-circuiting the electrode wirings 4 or 5 are formed. The short rings 15 for inspection are formed as far as marginal positions where ends of the electrode wirings 4 or 5 are cut out and a driving circuit can not be mounted, by chamfering. After the short rings 13 are eliminated by chamfering, resistance between the wirings 14 for inspection is measured. In the case that electric continuity exists, it can be found that chamfered amount is normal and ends for mounting are not lost.
申请公布号 JP2002009407(A) 申请公布日期 2002.01.11
申请号 JP20000183969 申请日期 2000.06.20
申请人 SHARP CORP 发明人 TANAKA MASASHI;SAITO TATSUJI
分类号 G02F1/13;G02F1/1345;H05K1/02;(IPC1-7):H05K1/02;G02F1/134 主分类号 G02F1/13
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