发明名称 PIEZOELECTRIC DEVICE AND ITS PACKAGE STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a surface mount type piezoelectric device in which a piezoelectric vibration chip supported in a package in a way of cantilever is stably fixed and supported by using a small consumed amount of a conductive adhesive to realize an excellent resistance to shock. SOLUTION: In the package having an insulation case 20 and a cover 21 joined to its upper part, an electrode pad 29 to mount a lead electrode 26 of a crystal vibration chip 22 in a way of cantilever is placed on a connection electrode 27 formed on the mount face of the insulation case close to a side wall 24a of the insulation case, and a slit 32 one end of which is open and the other end of which is closed is formed on a side of wall. When placing the crystal vibration chip on the electrode pad to which a conductive adhesive 33 is adhered and curing the adhesive the crystal vibration chip is fixed and supported between both sides of the base end provide with the lead electrode and the sidewalls of the insulation case as well as between the rear side of the base end and the electrode pad.
申请公布号 JP2002009576(A) 申请公布日期 2002.01.11
申请号 JP20000184020 申请日期 2000.06.20
申请人 SEIKO EPSON CORP 发明人 ENDO HIDEO
分类号 H01L23/12;H01L41/09;H01L41/18;H03H9/02;(IPC1-7):H03H9/02 主分类号 H01L23/12
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