| 摘要 |
PROBLEM TO BE SOLVED: To eliminate deterioration in heat dissipating due to permeation of bubbles in a heat conducting composition layer between a ceramic circuit board and a heat dissipating member, which is caused by warp of the ceramic circuit board due to heat generated by a semiconductor element. SOLUTION: In this ceramic circuit board, metal circuit board 2 is attached on the upper surface of a ceramic board 1, a dummy metal circuit board 3 corresponding to the metal circuit board 2 is attached on the lower surface of the board 1, and the dummy metal circuit board 3 is mounted on the heat dissipating member 5 via heat conducting composition 4. When an outer peripheral position of the metal circuit board 2 is set to X, an outer peripheral position of the dummy metal circuit board 3 is set to Y and the thickness of the ceramic board 1 is set to Z, a relation of 0<|X-Y|<=z/2 is held.
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