| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device which can be used as a polishing device of dry-in/dry-out type and by which the capacity per unit time and area of treating objects to be worked upon such as semiconductor wafers can be increased. SOLUTION: The polishing device is provided with polishing tables 34 and 36 each having a polishing surface, a top ring 32 which holds a semiconductor wafer 101 and presses the semiconductor wafer 101 against the polishing surface, a rotary transporter 27 which is placed in a position where the top ring 32 can reach and has plural stages positioned from the center of rotation up to a specified circumference, plural holding tables 600 which are detachably held by the stages of the rotary transporter 27, and a pusher 30 which vertically moves the holding tables 600 and transfers the semiconductor wafer 101 between the holding tables 600 and the top ring 32. |
