SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD, CONNECTOR FOR CONNECTING SEMICONDUCTOR DEVICE TO SUBSTRATE AND METHOD FOR CONNECTING SEMICONDUCTOR DEVICE TO SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which is possible to control an area for carrying a flat device, realize a large capacity memory module and increase the freedom of wiring for printed circuit board. SOLUTION: This semiconductor device has two devices 2 and 4 with a package containing a semiconductor chip. The device 2 of an upper stage is placed on a device 4 of a lower stage. The upper stage device 2 deviates from an external terminal 14 or the input side of the lower stage device 4 to the direction of an external terminal 16 on the output side, and the external terminal 14 on the input side of the lower stage device 4 is electrically connected to an external terminal 10 on the input side of the lower stage device 2.