| 摘要 |
PROBLEM TO BE SOLVED: To provide a film which can be used ideally as a dicing film for semiconductor wafer which is used at the time of dicing a semiconductor wafer and is made of a material containing no chlorine. SOLUTION: This dicing film is composed of a resin substantially containing no chlorine and has at least one mixed-resin layer containing (A) 20-80 wt.% propylene-based resin, (B) 10-50% copolymer of an aromatic vinyl compound and conjugated diene or its hydrogenated derivative resin, and (C) 0-40 wt.% petroleum resin, terpene resin, coumarone-indene resin, rosin-based resin, or their hydrogenated derivatives. |
