发明名称 POLISHING PAD GROOVING METHOD AND APPARATUS
摘要 <p>Grooves (70, 76, 78, &amp; 80-82) are formed in a CMP pad (12) by positioning the pad (12) on a supporting surface (10) with a working surface (22) of the pad (12) in spaced relation opposite to a router bit (24) and at least one projecting stop member (33) adjacent to the router bit (24), an outer end portion of the bit (24) projecting beyond the stop (33). When the bit (24) is rotated, relative axial movement between the bit (24) and the pad (12) causes the outer end portion of the bit (24) to cut an initial recess in the pad (12). Relative lateral movement between the rotating bit (24) and the pad (12) then forms a groove (70) which extends laterally away from the recess and has a depth substantially the same as that of the recess. The depths of the initial recess and the groove (70) are limited by applying a vacuum to the working surface (22) of the pad (12) to keep it in contact with the stop member(s) (33). Different lateral movements between the bit (24) and the pad (12) are used to form a variety of groove patterns (76, 78, &amp; 80-82), the depths of which are precisely controlled by the stop member(s) (33).</p>
申请公布号 WO2002002269(A1) 申请公布日期 2002.01.10
申请号 US2001020556 申请日期 2001.06.27
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